| Parameter | Symbol | Conditions | Min | Typical | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.0 | 6.0 | V | ||
| Input Low Voltage | VIL | IL = -0.1 mA | 0.3 | 0.8 | V | |
| Input High Voltage | VIH | IH = 0.1 mA | 2.0 | 3.5 | V | |
| Output Low Voltage | VOL | IOL = 4.0 mA | 0.0 | 0.1 | V | |
| Output High Voltage | VOH | IOH = -0.4 mA | 2.4 | 5.0 | V | |
| Propagation Delay Time | tpd | VCC = 5V, TA = 25°C | 6.0 | 9.0 | 12.0 | ns |
| Power Dissipation | PD | Continuous, per package | 100 | mW | ||
| Operating Temperature | TA | -40 | 85 | °C | ||
| Storage Temperature | TSTG | -65 | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
- Connect the ground (GND) pin to a stable 0V reference.
Input Signals:
- Apply input signals that meet the specified input low (VIL) and high (VIH) voltage levels.
- Avoid exceeding the maximum ratings for input currents.
Output Signals:
- The output low (VOL) and high (VOH) voltages should be within the specified ranges.
- Ensure that the output current does not exceed the maximum ratings to avoid damage.
Propagation Delay:
- The propagation delay time (tpd) is critical for timing considerations. It varies with supply voltage and temperature.
Temperature Considerations:
- Operate the device within the specified operating temperature range (-40°C to 85°C).
- Store the device within the storage temperature range (-65°C to 150°C).
Power Dissipation:
- Do not exceed the maximum power dissipation (PD) of 100 mW to prevent overheating and potential damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal circuits.
- Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Ensure proper mounting on a PCB to maintain mechanical stability and thermal performance.
- Use appropriate soldering techniques to avoid thermal shock and mechanical stress.
