| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage (VCC) | Operating supply voltage range | 2.0 | - | 6.0 | V |
| Input Low Voltage (VIL) | Maximum input low voltage | -0.5 | - | 1.5 | V |
| Input High Voltage (VIH) | Minimum input high voltage | 3.5 | - | 6.5 | V |
| Output Low Voltage (VOL) | Maximum output low voltage at IOL = 4 mA | -0.1 | - | 0.4 | V |
| Output High Voltage (VOH) | Minimum output high voltage at IOH = -4 mA | 2.4 | - | 5.25 | V |
| Propagation Delay Time (tpd) | Propagation delay time | - | 12 | 20 | ns |
| Power Dissipation (PD) | Maximum power dissipation | - | - | 100 | mW |
| Operating Temperature Range (TA) | Operating ambient temperature range | -40 | - | 85 | °C |
| Storage Temperature Range (TSTG) | Storage temperature range | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the specified range of 2.0V to 6.0V.
- Connect VCC to the positive power supply and GND to the ground.
Input Signals:
- Apply input signals that meet the specified input voltage levels:
- Input Low (VIL): ≤ 1.5V
- Input High (VIH): ≥ 3.5V
- Apply input signals that meet the specified input voltage levels:
Output Signals:
- The output signals will be:
- Output Low (VOL): ≤ 0.4V when sinking 4 mA
- Output High (VOH): ≥ 2.4V when sourcing -4 mA
- The output signals will be:
Propagation Delay:
- The propagation delay time (tpd) should be considered in timing-sensitive applications, with a typical value of 12 ns and a maximum of 20 ns.
Power Dissipation:
- Do not exceed the maximum power dissipation (PD) of 100 mW to avoid overheating and potential damage to the device.
Temperature Considerations:
- Operate the device within the specified operating temperature range (-40°C to 85°C).
- Store the device within the storage temperature range (-65°C to 150°C).
Handling:
- Handle the device with care to avoid static discharge, which can damage the sensitive components.
- Follow proper soldering techniques and ensure the device is securely mounted on the PCB.
Testing:
- Before finalizing the design, test the device under various conditions to ensure it meets the required performance specifications.
