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Radiant Advanced Devices Sdn Bhd
Radiant Advanced Devices Sdn Bhd 200701013572 (771577-X)
Waktu
Pejabat
Isnin - Jumaat 8:30 AM - 6:00 PM
Sabtu - Ahad Closed
Open Closed
Onesync AI

01-May-2025

Wafering blades have very thin cut Width,are recommended for precision cutting/sectioning or When cut Width loss needs to be minimized.There are plating, resin and metal bond 3 types configurations With Diamond or CBN.
 

DM Diamond Metal Bond Wafering Blade

Application: For very hard or brittle materials, glass ceramics, stone.

Order No

Code

Spec.(mm)

Package

01.05.720

DM101304

100*12.7*0.4

1 pc

01.05.725

DM131304

125*12.7*0.4

1 pc

01.05.730

DM151305

150*12.7*0.5

1 pc

01.05.741

DM181308

180*12.7*0.8

1 pc

01.05.748

DM202210

200*22.0*1.0

1 pc

01.05.760

DM253215

250*32.0*1.5

1 pc

01.05.770

DM303220

300*32.0*2.0

1 pc

 

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Trojan                                        Struers                Buehler                ATM
DP 101304                                 x                           x                            C
DP 151305                                 E0D15                  x                            C
DP 253215                                 E0D25                  x                            C
DM 101304                               M0D10                 IsoMet 20LC         A
DM 151305                               M0D15                 IsoMet 20LC         A    
DM 253215                               M0D25                 IsoMet 20LC         A    
DR 101304                                x                           IsoMet 15LC         x
DR 151305                                B0D15                  IsoMet 15LC         x
DR 253215                                B0D25                  IsoMet 15LC         x
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Radiant Advanced Devices Sdn Bhd 200701013572 (771577-X)
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