DR Diamond Resin Bond Wafering Blade
Application: For cutting hard, brittle or delicate materials including ceramics, composites, carbides and exotic metals.
|
Order No |
Code |
Spec.(mm) |
Package |
|---|---|---|---|
|
01.04.620 |
DR101304 |
100*12.7*0.4 |
1 pc |
|
01.04.625 |
DR131304 |
125*12.7*0.4 |
1 pc |
|
01.04.630 |
DR151305 |
150*12.7*0.5 |
1 pc |
|
01.04.640 |
DR181608 |
180*16.0*0.8 |
1 pc |
|
01.04.656 |
DR202310 |
200*22.0*1.0 |
1 pc |
|
01.04.660 |
DR253215 |
250*32.0*1.5 |
1 pc |
|
01.04.670 |
DR303220 |
300*32.0*2.0 |
1 pc |
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DM 101304 M0D10 IsoMet 20LC A
DM 151305 M0D15 IsoMet 20LC A
DM 253215 M0D25 IsoMet 20LC A
DR 101304 x IsoMet 15LC x
DR 151305 B0D15 IsoMet 15LC x
DR 253215 B0D25 IsoMet 15LC x
VN 2278 
BR 1939 
US 1684 
CN 871 
SG 531 
IN 491 
MX 373 
GB 368 
