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LINGTEC INSTRUMENTS SDN BHD
LINGTEC INSTRUMENTS SDN BHD 201701008787 (1222952-P)
SSM
VISITORS

05-Nov-2025

The Package Drop Test Machine is mainly used for the drop impact assessment of packages, that encountered in the real condition during transportation, loading and unloading. Package Drop Test simulates actual shocks by dropping the package and its content freely against a rigid plane surface from a predetermined height to evaluate its damage degree. The products inside the packaging respond to both the frequency and amplitude characteristics of the shock. By doing pre-shipment drop testing, it can help in designing a protective and cost-effective packaging solutions.

Drop test orientations:

  • Flat drop test
  • Edge drop test
  • Corner drop test

Testing standards£ºISTA 1A,1B,1C,1D,1E,1G,1H;2A,2B,2C,2D,2E;3A,3E,3F,3H;6A,6B,6C,6D.etc.

We can build drop test system that meet your requirements, please do contact us and email at info@lingtec.net for any drop testing application.

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Main Office

LINGTEC INSTRUMENTS SDN BHD 201701008787 (1222952-P)
2, Jalan Hillpark Niaga 9/1, Pusat Perdagangan Hillpark, 42300 Bandar Puncak Alam, Selangor, Malaysia.

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Other Office

Penang Branch
L1-1-5 Tingkat Kenari 5, Kenari Avenue, 11900 Bayan Lepas, Pulau Pinang, Malaysia.

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Singapore Branch
21, Toh Guan Road East, #04-11 Toh Guan Centre, Singapore 608609.

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Philippines Branch
144, 6th floor, Libran House Building, Legazpi Street, Legazpi Village, Makati, 1225 Philippines.

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Thailand Branch
70, Romklao 1 Road, Klong Song Tonnun, Ladkrabang, Bangkok 10520.

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