Generally, the reasons for crystal oscillator non-oscillation are summarized as follows:
1. Crystal Fracture

Solution:
1) Crystal fracture is an irreversible physical phenomenon, so this defect is stable and permanent. While it can cause crystal oscillator non-oscillation, it is relatively easy to eliminate. Jingnuowei crystal oscillators undergo a full inspection before shipment and eliminate such defective crystal oscillators.
2) Customers are advised to strictly adhere to the "Do Not Use If Dropped" principle during crystal oscillator transportation. During transportation, the product packaging should be strengthened to protect it from damage caused by excessive impact.

2. Conductive Adhesive Fracture
Analysis: A short circuit causes the crystal oscillator to fail or intermittently vibrate. This indicates that the conductive adhesive is of poor quality.

Solution: Jingnuowei crystal oscillators use imported, stable, high-quality adhesive to prevent this problem.

3. Excessive resistance
Analysis: The current intensity is insufficient to drive the chip to vibrate normally. The crystal oscillator has been stored for too long, or the internal space is not clean enough. Small water droplets or impurities can easily adhere to the chip surface, causing unstable operation or even failure. For example, the 49U package has a larger enclosed space than other packages. The chip is more susceptible to contamination during extended operation, resulting in frequency deviation and increased resistance, leading to instability.
Solution: We recommend that customers choose smaller crystal oscillators to avoid long-term storage. Jingnuowei crystal oscillators are vacuum-filled and nitrogen-filled to ensure a clean internal space.

4. Hidden contamination on the product's electrode surface can cause electrical parameter variations after production.

Analysis: Dirty welding workbench
Solution: We recommend that customers clean the machine and workbench before leaving each process. Cleaning method: Use a dust-free cloth dipped in alcohol to clean the machine and workbench. The shift supervisor should supervise and inspect.

5. Base Fracture
Analysis: The crystal oscillator base is fractured. The crystal oscillator is subjected to destructive physical forces, which causes the internal chip to break due to stretching or twisting, resulting in the crystal oscillator ceasing to oscillate.

(Crystal Internal Chip Cracked)

(Crystal Oscillator Base Cracked)

Solution:
1) Customers are advised to preheat the board before attaching the crystal oscillator to prevent the board from suddenly deforming due to heat and causing destructive physical impact on the crystal oscillator base.
2) Customers are advised to strictly adhere to the "Do Not Use If Dropped" principle during crystal oscillator operation, including in warehouses and production lines.
If dropped, stepped on, or placed on anything else, the crystal oscillator must not be used.

6.Crystal oscillator cessation due to damage caused by improper soldering.

Analysis: Dissection revealed a damaged crystal, causing the crystal to stop oscillating.
Solution: For cylindrical crystals that stop oscillating, we recommend that customers solder the crystal leads only to the area at least 1.0 mm from the lead to the fiberglass portion, and avoid soldering the crystal housing. Furthermore, heating the lead at high temperatures or for extended periods of time can damage the silver plating on the crystal's internal chip and cause resistance errors. Therefore, ensure that the lead heating temperature is below 300°C and the heating time is within 5 seconds (the outer shell should be heated below 150°C). Furthermore, during soldering, avoid pulling the crystal leads with force to prevent damage to the fiberglass portion of the base and the internal chip from contacting the housing.