Fixed abrasive for excellent polish/removal performance, edge control function

• Outstanding polish/removal performance using fixed abrasive
• Device surface contact-free concept
• Bevel profile control capability
• Wide/flexible polishing area coverage
• SEMI-S2/CE available

Features and Benefits

Model EAC is a bevel polishing system that removes defects and unneeded membranes by polishing the bevels on the edge of semiconductor wafers as well as the top edge and backside edge. Fixed abrasive allows for physical polishing without selection of polish target. Recipe-controllable polishing heads also enable high-precision control of the wafer edge shape.