Features: 

High automation, one-touch for rework, soldering, pick-up and placement of chip, easy operation.
Large power brushless DC fan, closed loop sensor, microcomputer zero trigger control, large volume air with constant temperature. No need of external air source, flexible application.
Seven-phase temperature zone, can be used for light-reflecting BGA, multi-layer BGA and metallic shielding case, POP.
Integrated design, the heating and alignment systems integrate well.
Dichromatic optical prism alignment, joystick control.
Transverse flow fan, air speed controllable, cool down bottom heating area and PCB as per process requirement.
QUICKSOFT interface, operation access and profile analysis functions available, can analyze preheating speed, peak temperature, temperature holding time and cooling rate effectively.
Various nozzles, easy replacement.
Applications: PC, Server Motherboard, IPC, Terminal and large PCB rework BGA or CONNECT.
 

Model	EA-A10
General Power	4200 W (Max)
Power Supply	220V AC 50HZ
Hot Air Heating Temperature	400°C(Max)
Bottom Preheating Temperature	400°C(Max)
Power Of Top Heater(Hot Air)	1200W
Power Of Bottom Heater(Infrared Preheating)	1600 W
Hot Air Flow	60 L/S
Bottom Radiation Preheating Size	400 mm * 400 mm
Max. Circuit Board Size	420 mm * 450 mm
Chip Size Range	2*2 mm – 60* 60 mm
Placement Accuracy	± 0.02 mm
Placement Force	1.5 N / zero pressure mounting (two modes)
Adjustable Air Speed Of Side Cooling Fan	≤35m3／min
Camera	36*12 times magnifying
	Horizontal resolution 500 lines
	PAL (phase alternation line) format
LED Lighting	White light source (luminance adjustable)
External K-Type Sensor	5 channels
Communication	USB
Overall Dimensions (L*W*H)	810 * 675 * 836 mm