Selective Plating - 1 Side is a precise plating technique used to selectively coat specific areas of a material with a desired metal finish. This process involves carefully masking or covering the areas that should not receive the plating treatment, leaving only the designated regions exposed for plating. The material is then immersed in an electrolyte solution, and an electrical current is applied to facilitate the deposition of the desired metal onto the exposed surfaces. Selective Plating - 1 Side offers unparalleled control and accuracy, allowing for intricate and complex patterns or designs to be achieved on the target material. This technique finds wide application in industries such as electronics, aerospace, and automotive, where precision and customization are paramount. From circuit boards to high-precision components, Selective Plating - 1 Side offers a cost-effective and efficient solution to create functional and decorative surface finishes tailored to specific requirements.