Functions of R8650C Fully Automatic BGA/SMD/PCB Soldering Machine
-
01 Precise Visual Alignment
Two sets of high-definition industrial cameras are used, and the repeat placement accuracy reaches ± 0.01mm. The 5 million pixels high-definition industrial camera system is for accurate measurement and positioning of the chip, the automatic vision software system automatically corrects the angle, and the image is displayed in HD.
High-definition CCD (5 million pixels) and high-definition CCD (1.3 million pixels) industrial cameras can accurately detect with telecentric lenses to avoid image distortion, eliminate measurement errors, achieve accurate alignment, and repeat alignment accuracy can reach ± 0.01mm.
-
02 ESD Lonizer
Equipped with ionizer, which effectively eliminates static electricity on the board and protects the product.
-
03 Precise Motion Platform
It adopts an industrial PC and servo motion control system to accurately control the X/Y/Z four-axis gantry structure to operate fully automatically and independently. It adopts a grinding marble platform and a precision grinding screw. The visual accuracy can reach ± 0.01mm.
-
04 Multifunctional Control Feature
The self-developed software system realizes fast positioning and stable temperature curve (with curve analysis function), easy operation and setting, and can automatically generate record files to achieve traceability of historical parameters. The operation interface is simple and fast, and a professional operation interface (system parameter setting, working mode setting, heating parameter setting, data recording, etc.) is set for different product characteristics, and there are Chinese and English interfaces to choose from.
-
05 Three Independently Editable Heat Zones
Three heat zones independently programmed and controlled; convection hot air heating in the upper zone and the lower zone, the lower zone adopts a large area heating wire layout, suitable for the repair of larger BGA, and the infrared preheating zone uses the German imported mediumwave ceramic infrared heating Plate heating. The area can reach 645 * 524mm.
-
06 Stable Temperature Control
High-definition K-type thermocouple with accuracy up to ± 1 ℃, dynamic PID multi-loop closed control selective reflow soldering process. With intelligent temperature compensation, and automatic memory function.
-
07 Bottom Heating System
The bottom preheating adopts the heating plate imported from Germany, and the built-in temperature measuring probe is more accurate, which effectively solves the heating temperature control effect. The bottom moving temperature zone automatically moves with the head to improve the board rework efficiency.
As one of the top BGA Rework Station suppliers in China, Seamark ZM is famous for its rich technical force, complete detection means, reliable product quality, full service. If you want to know the automatic BGA rework station and to get a perfect kind of repair machine for your factory, please contact Seamark ZM first.
Specification Of ZM R8650C Fully Automatic BGA/SMD/PCB Rework Station
| Power Supply | AC380V±10% 50/60HZ |
| Power |
22KW(Max)，Top heater(2KW) Bottom heater (2KW)，IR Preheater (16KW), Other(2KW) |
| PCB Size | 660*600mm(Max);10*10mm(Min) |
| BGA Chip Size | 100*100mm(Max);1*1mm(Min) |
| IR Heater Size | 640*520mm |
| Motion Control | X/Y/Z |
| Temperature Sensor | 8 Pcs |
| Control System | Industrial PC+ Servo motion control system |
| Display System | 24'' SD display |
| Alignment System | 2 Million pixels vision alignment |
| Vacuum Adsorption | Full automatic |
| Alignment Accuracy | ±0.025mm |
| Temperature Control | K-type thermocouple ( closed-loop ), each unit independent temperature control, temperature accuracy up to ±1℃ |
| Feeding Device | Semi-automatic |
| Positioning | L shape + universal fixture (shaped fixture can be customized) |
| Dimensions | L1235*W1215*H1850mm |
| Weight | 660KG |
