Standardized LED automatic optical inspection equipment.
It can perform appearance defect imaging on the front and back of the LED.
Dual track fast acquisition
The equipment adopts full-automatic loading and unloading and double-track quick image acquisition. It is inspected by machine vision and automatically rejects defective LED chips according to the inspection results.
Imaging
Can perform appearance defect imaging on the front and back of the LED
protection
Ion static elimination technology ensures the protection of materials during transmission, imaging, and poor processing
Ink mark
Use imported inkjet equipment to mark the detected appearance defect products with bad ink
Connection module
Connecting module with process equipment after LED packaging process
Equipment name: Online automatic Chip LED packaging appearance inspection machine
Bracket size: 510mm X 460mm (without inkjet device)
460mm X 350mm (including inkjet device)
Resolution: 6um ~ 10um (adjustable)
Dimensions: W1000mm X D1170mm X H1800mm
Dimensions: W2200 x D1520 x H1750 mm
Weight: 734KG
US 7020 
GB 6669 
CA 6097 
AU 5973 
IE 4049 
NZ 2261 
VN 1299 
BR 659 
