HAD 308
 
Plane-type High Speed Die Bonder
Cycle: 80ms
Compatible with SMD, COB, Diodes, Flip-chip, etc.
 
Features
 
1.      Internationally leading double die-bonding, double adhesive-dispensing and double die-searching system.
2.      Linear motor is applied to drive bond head.
3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C).
4.      Crystal frame automatic correction chip structure.
5.      Programmed control constant-temperature adhesive dispensing system is also applied.
6.      Vacuum die missing testing technology is adopted.
7.      Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency.
8.      IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces.
9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness.
10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.
 
 
Specifications and Parameters
 

1. Production Cycle		4. Die Bonder’s Swing Arm-and-hand system
Production Cycle	80ms (depending on chip size and bracket)	Die Bonder Swing Arm	90° Rotatable Die Bond
Accuracy	± 1mil (±0.025mm）	Die Bond Pressure	20g-250g (Adjustable)
Die Rotation	± 1°	5. Loading Workbench
2. Chip XY Workbench		Range of Stroke	300mm*75mm
Chip Dimensions	5mil×5mil-80mil×80mil (0.13mm*0.13mm-2mm*2mm)	XY Resolution	0.02mil (0.5μm)
		6. Suitable Holder Size
Max. Angle Correction	± 15°	Length	145mm ~ 300mm
Max. Chip Ring Size	8″/210mm (Outer Diameter)	Width	40mm~ 75mm
Max. Chip Area	6.5″/165mm (Expanded)	7. Facilities Needed
Resolution	0.04mil  (1μm)	Voltage/Frequency	220V AC±5%/50HZ
Thimble Z Height Travel	80mil (2mm)	Compressed Air	0.5MPa (MIN)
		Rated Power	950W
3. Image Recognition System		Gas Consumption	5L/min
Image Identification	256 grayscale	8. Volume and Weight
Resolution	656 x 492 pixels	Length x Width x Height	175 x 125 x 185cm
Image Recognition Accuracy	± 0.025mil@50mil Observation Range	Weight	1470kg