Elite Etch Cu

This model incorporates an advanced heating and cooling system which prevents metal damage in integrated circuits containing copper.

Product Information
 

The Elite Etch Cu improves upon the design of the Elite Etch 7000 by incorporating a rapid heating and cooling system. Using a thermal exchanger directly contacting the etch head and acid lines, sulfuric acid decapsulation rate is accelerated to reduce overall volume usage. A precise acid temperature combined with a high delivery rate allows decapsulation of copper wired devices without causing damage to the metallized wires. The specially designed acid heat exchanger can accurately control the acid temperature between 10° and 250° C with flow rates of up to 8 ml per minute. The high acid pulse rates allow for reasonable etch times even at the lowest temperatures.

 

The Elite Etch Cu features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal.

 

The device hold-down assembly (ram nose) is a pneumatically activated push rod. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose secures the sample package and a definition gasket to the etch head, thus eliminating movement of either the package or its fixturing.

 

RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid.