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Microx Tech Advance Sdn. Bhd.
Microx Tech Advance Sdn. Bhd. 202201011348 (1457045-M)
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16-Apr-2025

Cressington 208HRD High Resolution Sputter Coater from Cressington offers real solutions to the problems encountered when coating difficult samples for FESEM imaging. FESEM applications need extremely thin, fine-grained, uniform coatings to eliminate charging and to improve contrast on low density materials. In order to minimize the effects of grain size, the 208HR offers a full range of coating materials and gives unprecedented control over thickness and deposition conditions. The 208HRD Turbo Pumped High Vacuum System offers a wide range of operating pressures allowing precise control of both uniformity and conformity of the coating, minimizing charging effects.

The 208HRD employs a compact 28mm diameter target design that offers higher efficiency to better utilize more expensive target materials such as iridium. An additional benefit with using a smaller diameter sputter source is that it helps lower the total system cost with target compared to larger target systems.

Sputter Target : Cr, Pd/Pt as standard, ( Ta, Au, Au/Pd, Pt, Ir or W is optional )
 

The main features are:-

  • Wide Choice of Coating Materials Magnetron head design and effective gas handling allow a wide choice of target materials (see specification).
  • Economical target utilization. The 208HRD offers a smaller diameter target and modified chamber configurations to give more economical usage for costly materials like iridium.
  • Precision Thickness Control. Thickness optimized for FESEM application using the MTM-20 High Resolution Thickness Controller, which has a resolution of 0.1nm. This enables precise and reproducible thin coatings, especially in the range of 0.5 - 3nm, a thickness desirable for FESEM applications.
  • Multi-angle Stage Movements. Separate rotary, planetary and tilting stage movements ensure uniform coating with excellent conformity, even on highly topographic samples.
  • Variable Chamber Geometry: Chamber geometry is used to adjust deposition rates from 1.0 nm/sec to 0.002 nm/sec to optimize structure.
  • Wide Range of operating Pressures: Independent power/pressure adjustment allows operation at argon gas pressure ranges.
  • Compact Modern Benchtop Design: Space and energy saving design eliminates need for floor space, water, specialized electrical connections.


#SEM #FESEM #FIB #TEM #EDS

#Quorum #Emitech #Leica #Luxor #Tedpella #Hitachi #Jeol

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Microx Tech Advance Sdn. Bhd. 202201011348 (1457045-M)
59, Lorong Seri Sejahtera 8, Taman Seri Sejahtera Alma, 14000 Bukit Mertajam, Pulau Pinang, Malaysia.

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网址: https://www.microx.com.my
网址: https://microx.newpages.com.my/
网址: https://microx.onesync.my/

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