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Grand Tech Innovation Sdn. Bhd.
Grand Tech Innovation Sdn. Bhd. 202201017001 (1462698-T)
营业
时间
星期一 - 星期五 8:30 AM - 6:00 PM
星期六 - 星期日 休息
我们在 公共假期休息
营业 休息

29-Aug-2024

FCBGA (Flip-Chip Ball Grid Array)

Optimize Your FCBGA Assembly Processes with Our Specialized Tools and Equipment

Our comprehensive range of FCBGA tools and equipment is designed to enhance the precision, efficiency, and reliability of your assembly processes. From dipping solutions to vacuum blocks and specialized tooling, we cater to all your FCBGA production needs.
 


Dipping Plate & Dipping Tank

Features:

  • Efficient Coating: Designed for uniform and consistent application of materials on FCBGA components.
  • Customizable Sizes: Available in various sizes to fit different production requirements.
  • High-Quality Construction: Made from durable materials to withstand repetitive use.
  • Easy Maintenance: Designed for simple cleaning and maintenance.
     

Height Gauge

Features:

  • Precision Measurement: Provides accurate height measurements of FCBGA components.
  • Easy Calibration: Simple calibration process for maintaining measurement accuracy.
  • Sturdy Design: Constructed with durable materials for long-term reliability.
  • Versatile Use: Suitable for various FCBGA sizes and configurations.
     

FCA & UDF Vacuum Block

Features:

  • Secure Handling: Ensures stable and secure handling of FCBGA components during assembly.
  • High Precision: Engineered for precise alignment and positioning.
  • Durable Construction: Built to withstand rigorous production environments.
  • Custom Options: Adaptable to specific FCBGA designs and assembly needs.
     

Auto & Manual Lid Attach

Features:

  • Automated Precision: Ensures accurate and consistent lid attachment in automated processes.
  • Manual Flexibility: Offers precise manual operation for small-scale or specialized tasks.
  • Robust Design: Designed for durability and reliability in high-volume production.
  • Customizable Settings: Tailor the attachment process to specific requirements.
     

Auto Ball Mount Tooling

Features:

  • Precision Ball Placement: Ensures accurate placement of solder balls on FCBGA components.
  • Automated Efficiency: Speeds up production with reliable automated processes.
  • Durable Tooling: Built to withstand repeated use in high-volume production environments.
  • Custom Solutions: Tailor the tooling to fit specific ball sizes and grid patterns.
     

Manual SBM (Solder Ball Mount) Tooling

Features:

  • Precision Control: Allows for precise manual placement of solder balls.
  • Flexible Application: Suitable for small-scale or specialized FCBGA assembly tasks.
  • Ergonomic Design: Designed for ease of use and operator comfort.
  • Customizable Options: Adapt the tooling to fit specific requirements.

     

Enquiry Flow:

  • Initial Consultation: Share your specific FCBGA assembly requirements and application details with our team.
  • Technical Review: Provide detailed drawings, specifications, or samples for thorough analysis.
  • Design Finalization: Collaborate with our team to review and finalize the design based on your needs.
  • Quotation Process: Receive a detailed quotation that includes customization options, quantities, and any additional features.
  • Sample Approval: Approve a master sample to ensure it meets your standards before moving to mass production.
     
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总办事处

Grand Tech Innovation Sdn. Bhd. 202201017001 (1462698-T)
54, Jalan Niaga Enggang 1, Taman Enggang, 76100 Durian Tunggal, Melaka, Malaysia.

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网址: https://www.gtisb.com/
网址: https://gtisb.newpages.com.my/
网址: https://gtisb.onesync.my/

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SG BRANCH
81 Ubi Ave 4, #06-20 UB One, Singapore 408830.

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