An advanced chip and glass sorting system designed to separate components attached to blue or UV film using customer-provided mapping data. It accurately places sorted components into designated bins and supports wafer sizes up to 8″. Built for speed, precision, and automation, it ensures stable production performance in semiconductor back-end processes.
Key Specifications:
- Face-to-face transfer mechanism
- Enables efficient component transfer between films
- Automatic nozzle height measurement & setting
- Ensures consistent and accurate picking
- Program-controlled pick failure detection
- Adjustable sensor sensitivity for reliable operation
- Automatic bonding position correction
- Delivers precise and repeatable placement
- Fully automated loading & unloading
- Dual-side automation improves operator efficiency
- Visual positioning & CPK calculation
- Accurate wafer feeding and real-time quality analysis
- Strict mapping pick rules
- Guarantees correct component selection
- Pick failure alerts & software recovery
- Immediate notification with built-in resolution functions
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