Product Overview
The TIP900 system is a comprehensive thermal imaging and noncontact profiling system designed to supervise the temperature of wallboards coming out of the oven. It uses an infrared thermal imager to continuously scan the entire board surface temperatures and allows the detection in real time of moisture and density variations inside each board.
The powerful TIP900 software provides sophisticated data integration, visualization and event analysis, and offers users a complete solution of real-time monitoring, detection and traceability. It also analyzes and provides optimal oven dryer profile balance.
The detailed wallboard quality maps, the historical temperature trend charts and the images can be seen locally at the operator workstation or remotely. All data is stored in the LogViewer database for complete process visibility and long term traceability.
TIP900 System Software
- Detailed continuous board quality monitoring (100% of all board images are archived)
- Easy recipe setup – automated scaling
- Automated board defect detection and rejection
- Ethernet connectivity: process data, defect reports, dryer balance profile, etc., can be shared with HMI/SCADA
- Dynamic deck-to-deck dryer profile balance monitoring
- Failure identification function tracked in database
- Database LogViewer for historical analysis (for remote access viewing of any TIP900 on a company network)
- Configurable reject/alarm parameters
US 5017 
BR 2858 
VN 2196 
AU 990 
JP 975 
TH 966 
CA 906 
SG 707 
