NIR confocal microscopy is ideally suited for use at various points within the failure analysis (FA) workflow because it is non-destructive and allows inspection of both Si bulk integrity and active level/layer areas. The imaging technique has been applied to Flip Chip, WLCSP, and doped wafers. Other applications include integrity inspection after bonding, sacrificial oxide layer inspection after etching, inspection for chipping and cracks after grinding or dicing, and inspecting SIP (system in package), 3D mounting, or CSP (chip scale packages).
Now in its 3rd generation, WDI’s flagship IR Laser Scanning Confocal Imaging System features a powerful combination galvo & resonance scanner and full automation of all components. It is ideally suited for automated non-destructive, high resolution, subsurface imaging of silicon wafers, IC chips, MEMS and other devices.
Features- Powerful confocal laser, galvo & resonance imaging at depth even in heavily doped substrates.
- Autofocus and Optical Offset Adjuster ensure reliable focusing and tracking during in-depth imaging even while scanning.
- Precise motorized 300mm XY-stage and Z-stage to accommodate a wide range of sample types and sizes.
- Active anti-vibration table, granite structure and laser safe acoustic enclosure permit high resolution sub-micron imaging.
Applications- Various points within the semiconductor failure analysis (FA) workflow including Product Construction Analysis, Reliability Reject FA, Yield Analysis FA and customer return FA.
