Functions of Zhuomao ZM R5860 Smart BGA Rework Equipment
-
01 Temperature Curve Setting
High-definition touch screen operation, real-time display and, editing of temperature curves, each group of temperature curves can be set to 8 segments, 100 groups of temperature curves can be stored, with temperature self-organizing function.
-
02 Laser Red-dot Positioning Guide
Laser indicator for PCB and component positioning.
-
03 Vacuum Adsorption
The external vacuum suction pen is convenient for taking BGA.
Specification Of Seamark ZM-R5860 Hot Air BGA Rework Station
| Power Supply | AC220V±10% 50/60HZ |
| Power | 5.0KW(Max)，Top heater(0.8KW) Bottom heater (1.2KW)，IR Preheater (2.7KW),Other(0.3KW) |
| PCB Size | 410*370mm(Max); 10*10mm(Min) |
| BGA Chip Size | 40*40mm(Max); 10*10mm(Min) |
| IR Heater Size | 375*285mm |
| Temperature Sensor | 1 pcs |
| Operation Method | 7'' HD touch screen |
| Control System | Autonomous heating control system V1（software copyright） |
| Alignment System | Laser dot |
| Vacuum Adsorption | Manual |
| Temperature Control | K-type thermocouple closed-loop control with accuracy up to ±3℃ |
| Positioning | V-groove with universal fixture |
| Dimensions | L635*W620*H655mm |
| Weight | 43.5KG |
