Please login to use this feature. You can use this feature to add the product to your favourite list.
Close
You have added this product to your favorite list. Check My Favourite
Close
You have removed this product from your favourite list.
Close
Please login to use this feature. You can use this feature to add the company to your favourites list.
Close
This company has been added successfully. Check My Favourite
Close
This company has been removed from your favourite list.
Close
Please login to use this feature. You can use this feature to add the company to your inquiry cart.
Close
This company has been added to your inquiry cart.
Close
This company has been removed from your inquiry cart.
Close
This product has been added to your inquiry cart.
Close
This product has been removed from your inquiry cart.
Close
Maximum number of Product/Company has been reached in inquiry cart.
Close
Fictron Industrial Supplies Sdn Bhd
Fictron Industrial Supplies Sdn Bhd 200601019263

Nvidia Chip Takes Deep Learning to the Extremes

03-Jul-2019

There's no doubt that GPU-powerhouse Nvidia would love to have an answer for all size scales of AI — from substantial data center jobs down to the always-on, low-power neural networks that listen for wakeup words in voice assistants.
 
Right now, that would take a number of different technologies, because none of them scale up or down very well. It is evidently preferable to be able to deploy one technology compared to many. So, according to Nvidia chief scientist Bill Dally, the company has been seeking to answer the question: “Can you build something scalable... while still maintaining competitive performance-per-watt across the entire spectrum?” 
 
It appears like the answer is yes. Last month at the VLSI Symposia in Kyoto, Nvidia outlined a small test chip that can work on its own to do the low-end jobs or be linked tightly together with up to 36 of its kin in a single module to do deep learning’s heavy lifting. And it does it all while achieving around the same top-class performance.
 
The individual accelerator chip is fashioned to operate the execution side of deep learning in place of the training part. Engineers normally measure the performance of such “inferencing” chips in terms of how many operations they can do per joule of energy or millimeter of area. A single one of Nvidia’s prototype chips peaks at 4.01 tera-operations per second (1000 billion operations per second) and 1.29 TOPS per millimeter. As compared to prior prototypes from other groups using the same precision the single chip was at least 16 times as area efficient and 1.7 times as energy proficient. But linked together into a 36-chip system it reached 127.8 TOPS. That’s a 32-fold performance boost.
 
Companies have typically been tuning their technologies to work suitable for their particular niches. Like for example, Irvine, Calif.,-startup Syntiant uses analog processing in flash-memory to boost performance for very-low power, low-demand applications. While Google’s original tensor processing unit’s powers would be wasted on anything other than the data center’s high-performance, high-power environment.
 
With this research Nvidia is trying to demonstrate that one technology can operate well in all those situations. Or at the very least it can if the chips are linked together with Nvidia’s mesh network in a multichip module. These modules are virtually small printed circuit boards or slivers of silicon that hold various chips in a way that they can be treated as one large IC. They are becoming even more popular, because they allow systems composed of a couple of smaller chips—often called chiplets—instead of a single larger and more expensive chip.
 
“The multichip module option has a lot of advantages not just for future scalable [deep learning] accelerators but for building version of our products that have accelerators for different functions,” explains Dally.
 
Answer to the Nvidia multichip module’s ability to bind together the new deep learning chips is an interchip network that uses a technology called ground-referenced signaling. As its name connotes, GRS uses the difference between a voltage signal on a wire and a common ground to transfer data, while preventing many of the known pitfalls of that approach. It can transmit 25 gigabits/s using a single wire, whereas most technologies would need a pair of wires to reach that speed. Using single wires boosts how much data you can stream off of each millimeter of the edge of the chip to a whopping terabit per second. What’s more, GRS’s power consumption is a mere picojoule per bit.
 
“It’s a technology that we developed to basically give the option of building multichip modules on an organic substrate, as opposed to on a silicon interposer, which is much more expensive technology,” says Dally.
 
The accelerator chip presented at VLSI is hardly the last word on AI from Nvidia. Dally says they’ve already completed a version that actually doubles this chip’s TOPS/W. “We believe we can do better than that,” he says. His team aspires to find inferencing accelerating techniques that blow past the VLSI prototype’s 9.09 TOPS/W and reaches 200 TOPS/W while still being scalable.
 
Source: Tronserve
Pejabat Utama

Fictron Industrial Supplies Sdn Bhd 200601019263
No. 7 & 7A, Jalan Tiara, Tiara Square, Taman Perindustrian Sime UEP, 47600 Subang Jaya, Selangor, Malaysia.

Tel:
Fax:

Emel:
Laman Web: http://www.fictron.biz
Laman Web: https://fictron.newpages.com.my/
Laman Web: https://fictron.n.my/
Laman Web: http://fictron.newstore.my/

Pejabat Lain

Fictron Industrial Automation Pte Ltd
140 Paya Lebar Road, #03-01, AZ @ Paya Lebar 409015, Singapore.

Tel:
Emel:

Melayari Melalui : Laman Utama - Klasifikasi - Syarikat - Tempat - Tag - Produk - Berita Baru dan Promosi - Jawatan Kosong - Laman Web Mudah Alih - Google - Keputusan SEO

NEWPAGES

Seni Jaya Logo
Brochure
Download
Our PackageContact Us