Machine Specification
Machine Name	Double Platform High Precision Laser Cutting System
Laser	20W UV Laser
Wavelength	355nm
Cutting Platform	350mm×500mm
Platform	Double Platform
Application Objects	LCP, MPI, PI, FR4, FR5, CEM, Polyester, Ceramic and other RF materials
Comprehensive Accuracy	±0.025mm
Loading and Unloading	Manually
Support Files	DXF, DWG and etc
Operation System	WIN10
Machine Dimension	1600 x 1600 x 1720 mm - Subject to revision
Weight	2500kg – Subject to revision

The Double Platform Laser Depaneling Machine is a high-precision solution designed to meet market demands for efficient and accurate cutting of FPC and PCB products. Engineered for reliability and ease of use, this advanced system integrates multiple cutting and positioning mechanisms to ensure superior performance.
Key Advantages:

• Strong Compatibility – Supports various FPC and PCB materials with adjustable cutting dimensions.
• High Precision – Delivers precise and clean cuts, minimizing material stress and defects.
• Fast Processing Speed – Optimized for high efficiency, improving production throughput.
• Excellent Stability – Ensures consistent performance with a robust and reliable design.
• Compact & Space-Saving – Designed for efficient use of workspace without compromising functionality.
• User-Friendly Software & Hardware – Fully developed in-house for seamless operation and easy integration.

Equipped with an advanced laser cutting system and an effective dust removal mechanism, this machine is the perfect choice for manufacturers seeking precision, speed, and reliability in their PCB depaneling processes.