Selective Plating is a specialized electroplating technique that allows for precise and controlled deposition of metal onto specific areas of a substrate. This process involves the careful masking or covering of areas that should not receive the plating treatment, leaving only the desired regions exposed. The exposed surfaces are then subjected to an electrolytic solution along with the application of an electrical current, facilitating the deposition of the desired metal onto those areas. Selective Plating offers exceptional flexibility and accuracy, enabling the application of plating coatings to intricate or complex geometries, such as edges, recesses, or specific contact points. This technique finds wide application in various industries, including electronics, automotive, aerospace, and jewelry, where targeted plating is necessary to achieve specific functional or aesthetic requirements. Selective Plating provides a cost-effective and efficient solution for enhancing the durability, conductivity, corrosion resistance, and overall quality of components and products.