Functions of R9100 Super Large Board Disassembly Preheating Platform
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Non-Contact Single-Point Desoldering
Non-contact desoldering is achieved with the assistance of precision load cells and barometric height measurement, reducing the risk of BGA damage, scrapping, and solder pad abrasion during the desoldering process. It also supports rapid generation of desoldering paths without Gerber files for panelized boards.
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High-Resolution CCD Vision System
Equipped with a 5-megapixel top camera and a 12-megapixel bottom camera. Using independently developed control software and algorithms, the system delivers high alignment accuracy and a high level of automation. For rework at the same position on identical PCBs, alignment is required only once, after which “one-click rework” can be performed.
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Four Independent Preheating Platforms
Configured with four independent preheating and heating platforms: top-side soldering/desoldering, top-side solder removal, bottom-side heating, and a movable temperature zone. Each platform is equipped with its own heating and temperature control system. All heating, preheating platforms, and the desoldering head adopt closed-loop temperature control, ensuring stable and accurate overall temperature regulation.
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Safety Protection
Strict standards are applied to product yield and operator safety. The equipment is equipped with dual-stage light curtains, independent secondary protection for each heating module, load cells on all downward-pressing modules, and limit switches on all doors and windows. Alarms are triggered in cases of over-temperature, personnel entering the working area, or position overtravel.
Specification
| Category | Model: ZM-R9100 | Specifications |
| Equipment Performance Parameters | Power | Total Power 22.8KW (Upper Temperature Zone: 2KW, Lower Temperature Zone: 2KW, Preheating Zone: 16KW, Desoldering Head: 1KW) |
| PCB Board Size | 700X635mm (Max) 10X10mm (Min) | |
| Compatible Chip Size | 120mm*120mm (Max) 1mm*1mm (Min) | |
| IR Zone Size | 695mm*590mm | |
| Positioning Method | L-shaped Card Slot and Universal Fixture (Custom Special-shaped Fixture Available) | |
| Control System | Industrial PC + Servo Motion Control System | |
| Alignment Accuracy | ±0.025mm | |
| Desoldering Head Heater Temperature | ≤600°C (Adjustable) | |
| Desoldering Height Residue | ≤15% | |
| Desoldering Quantity Residue | ≤10% | |
| Desoldering Nozzle | Replaceable, Diameter Φ0.2mm-Φ3mm | |
| Desoldering Nozzle Height Control Method | Real-time Adjustment via Vacuum Feedback | |
| BGA Substrate Deformation | Flatness ≤0.15mm | |
| Solder Ball Size | 0.2mm-0.76mm | |
| Desoldering Recovery | Filter Cartridge Replacement | |
| Alignment System | Upper Camera: 5.0MP, Lower Camera: 12.0MP; Pixel Accuracy: 0.015mm/pixel, Field of View: Upper 39mm*29mm, Lower 59mm*44mm | |
| Product Changeover Time (After Debugging) | 20min | |
| Temperature Measurement Interface | 7 Interfaces | |
| Equipment Dimensions | L1450xW1600xH1757mm | |
| Equipment Weight | 1205KG |
