NIR confocal microscopy is ideally suited for use at various points within the failure analysis (FA) workflow because it is non-destructive and allows inspection of both Si bulk integrity and active level/layer areas. The imaging technique has been applied to Flip Chip, WLCSP, and doped wafers. Other applications include integrity inspection after bonding, sacrificial oxide layer inspection after etching, inspection for chipping and cracks after grinding or dicing, and inspecting SIP (system in package), 3D mounting, or CSP (chip scale package Now in its 2nd generation, WDI’s LSCM IR Laser Scanning Confocal Imaging System features a powerful combination galvo & resonance scanner and automation of key components. It is ideally suited for the non-destructive, subsurface imaging of silicon wafers, IC chips, MEMS, solar panels, and other devices.
Features- Powerful confocal laser, galvo & resonance imaging at depth even in heavily doped substrates.
- Autofocus and Optical Offset Adjuster ensure reliable focusing and tracking during in-depth imaging even while scanning.
- Precise motorized 200mm XY-stage and Z-stage to accommodate a wide range of sample types and sizes.
- Breadboard base, extruded aluminum structure and laser safe acoustic enclosure.
Applications- Various points within the semiconductor failure analysis (FA) workflow including Product Construction Analysis, Reliability Reject FA, Yield Analysis FA and customer return FA.
