Semiconductor IC packaging dispensing is a specialized process employed in the production of integrated circuits (ICs) to apply adhesives, encapsulants, or underfill materials that protect and connect the delicate semiconductor chips. This precise and controlled dispensing process ensures the reliable and consistent placement of materials onto the IC packages. Semiconductor IC packaging dispensing requires sophisticated equipment, such as high-precision dispensers and robotic systems, to accurately dispense the materials in the desired locations. The dispensing process involves the application of adhesives for chip attachment, encapsulants for chip protection, and underfill materials for enhancing the mechanical stability and thermal performance of the ICs. The dispensing equipment allows for fine-tuning of parameters such as volume, flow rate, and dispensing pattern to achieve optimal bonding and encapsulation results. Semiconductor IC packaging dispensing is a critical step in IC manufacturing, as it ensures the integrity, reliability, and longevity of the semiconductor devices. By providing precise material placement and encapsulation, this process safeguards the ICs against moisture, mechanical stress, and external contaminants, contributing to their overall performance and functionality.