Features	High-resolution and high-precision X - Y table. Capable of handling 12″ wafer. High speed inspection. Micro defect inspection of up to 5 micron. Window platform with user-defined specification. Built-in calibration feature. Auto-generation of GR & R report. Library based uploading for different types of die.
Functions	Automated optical inspection of micro wafer defects. Automated defect classification. Optional storage of defect images for engineering analysis. Wafer map creation / updated of loaded wafer map. Optional inking capability for defect dies. Statistical descriptive analysis of defects. Die counting.